T. S. Copetti, M. Fieback, T. Gemmeke, S. Hamdioui, L. M.Bolzani Poehls (2024), A DfT Strategy for Guaranteeing ReRAM’s Quality after Manufacturing, In Journal of Electronic Testing: Theory and Applications (JETTA).

Hanzhi Xun, Moritz Fieback, Sicong Yuan, Hassen Aziza, Mathijs Heidekamp, Thiago Copetti, Leticia Bolzani Poehls, Mottaqiallah Taouil, Said Hamdioui (2023), Characterization and Test of Intermittent Over RESET in RRAMs, In Proceeding of the 2023 IEEE 32nd Asian Test Symposium (ATS), IEEE.

Hanzhi Xun, Moritz Fieback, Sicong Yuan, Ziwei Zhang, Mottaqiallah Taouil, Said Hamdioui (2023), Data Background-Based Test Development for All Interconnect and Contact Defects in RRAMs, In Proceedings of the 2023 IEEE European Test Symposium (ETS), IEEE.

Manil Dev Gomony, Anteneh Gebregiorgis, Moritz Fieback, Marc Geilen, Sander Stuijk, Jan Richter-Brockmann, Rajendra Bishnoi, Mottaqiallah Taouil, Said Hamdioui, More Authors (2023), Dependability of Future Edge-AI Processors: Pandora’s Box, In Proceedings of the 2023 IEEE European Test Symposium (ETS), IEEE.

Ahmed Aouichi, Sicong Yuan, Moritz Fieback, Siddharth Rao, Woojin Kim, Erik Jan Marinissen, Sebastien Couet, Mottaqiallah Taouil, Said Hamdioui (2023), Device Aware Diagnosis for Unique Defects in STT-MRAMs, In Proceedings of the 2023 IEEE 32nd Asian Test Symposium, ATS 2023, IEEE.

Sicong Yuan, Mottaqiallah Taouil, Moritz Fieback, Hanzhi Xun, Erik Jan Marinissen, Gouri Sankar Kar, Sidharth Rao, Sebastien Couet, Said Hamdioui (2023), Device-Aware Test for Back-Hopping Defects in STT-MRAMs, In 2023 Design, Automation and Test in Europe Conference and Exhibition, DATE 2023 - Proceedings, Institute of Electrical and Electronics Engineers (IEEE).

Hanzhi Xun, Sicong Yuan, Moritz Fieback, Mottaqiallah Taouil, Said Hamdioui, Hassen Aziza (2023), Device-Aware Test for Ion Depletion Defects in RRAMs, Cristina Ceballos (Eds.), In Proceedings of the 2023 IEEE International Test Conference (ITC) p.246-255, IEEE.

S. Yuan, Z. Zhang, M. Fieback, H. Xun, E. J. Marinissen, G. S. Kar, S. Rao, S. Couet, M. Taouil, S. Hamdioui (2023), Magnetic Coupling Based Test Development for Contact and Interconnect Defects in STT-MRAMs, In Proceedings - 2023 IEEE International Test Conference, ITC 2023 p.236-245, Institute of Electrical and Electronics Engineers (IEEE).

Moritz Fieback, Filip Bradarić, Mottaqiallah Taouil, Said Hamdioui (2023), Online Fault Detection and Diagnosis in RRAM, In Proceedings of the 2023 IEEE European Test Symposium (ETS), IEEE.

Abhairaj Singh, Moritz Fieback, Rajendra Bishnoi, Filip Bradarić, Anteneh Gebregiorgis, Rajiv V. Joshi, Said Hamdioui (2022), Accelerating RRAM Testing with a Low-cost Computation-in-Memory based DFT, Cristina Ceballos (Eds.), In Proceedings - 2022 IEEE International Test Conference, ITC 2022 p.400-409, IEEE.