T Marconi, C Spagnol, E Popovici, SD Cotofana (2014), Towards energy effective LDPC decoding by exploiting channel noise variability, L Garcia (Eds.), In Proceedings - 2014 22nd International Conference on Very Large Scale Integration p.1-6.

GR Voicu, M Lefter, M Enachescu, SD Cotofana (2013), 3D stacked wide-operand adders: A case study, T El-Ghawazi, M Smith et al (Eds.), In Proceedings 2013 IEEE 24th International Conference on Application-specific Systems, Architectures and Processors p.133-141.

N Cucu Laurenciu, SD Cotofana (2013), A direct measurement scheme of amalgamated aging effects with novel on-chip sensor, s.n. (Eds.), In 21st IFIP/IEEE international conference on very large scale integration p.1-6.

C Chen, SD Cotofana (2013), A low cost method to tolerate soft errors in the NoC router control plane, s.n. (Eds.), In 26th Annual IEEE International SoC Conference) p.374-379.

C Chen, SD Cotofana (2013), An efective routing algorithm to avoid unnecessary link abandon in 2D mesh NoCs, s.n. (Eds.), In 16th Euromicro Conference on Digital System Design p.311-318.

EK Bankas, KA Gbolagade, SD Cotofana (2013), An effective new CRT based reverse converter for a novel moduli set { 2^(2n+1)-1, 2^(2n+1), 2^(2n)-1 }, T El-Ghawazi, M Smith et al (Eds.), In Proceedings 2013 IEEE 24th International Conference on Application-specific Systems, Architectures and Processors p.142-146.

C Bira, L Gugu, R Hobincu, V Codreanu, L Petrica, SD Cotofana (2013), An energy effective SIMD accelerator for visual pattern matching, s.n. (Eds.), In 4th International symposium on highly efficient accelerators and reconfigurable technologies p.1-4, Association for Computing Machinery (ACM).

N Cucu Laurenciu, SD Cotofana (2013), A nonlinear degradation path dependent end-of-life estimation framework from noisy observations, In Microelectronics Reliability Volume 53 p.1213-1217.

N Aymerich, SD Cotofana, A Rubio (2013), Controlled degradation stochastic resonance in adaptive averaging cell based architectures, In IEEE Transactions on Nanotechnology Volume 12 p.888-896.

M Lefter, GR Voicu, M Taouil, M Enachescu, S Hamdioui, SD Cotofana (2013), Is TSV-based 3D integration suitable for inter-die memory repair?, s.n. (Eds.), In Design, automation & test in Europe conference & exhibition p.1-4.