Mihai Lefter (2018). On Leveraging Vertical Proximity in 3D Memory Hierarchies. PhD Thesis, Delft University of Technology.

Marius Enachescu, Mihai Lefter, George Voicu, Sorin Cotofana (2018). Low-Leakage 3D Stacked Hybrid NEMFET-CMOS Dual Port Memory. IEEE Transactions on Emerging Topics in Computing 6 184-199.


Mihai Lefter, Thomas Marconi, George Voicu, Sorin Cotofana (2017). Low cost multi-error correction for 3D polyhedral memories. In 2017 IEEE/ACM International Symposium on Nanoscale Architectures, 13-18, IEEE.

Mihai Lefter, George Voicu, Thomas Marconi, Valentin Savin, Sorin Cotofana (2017). LDPC-Based Adaptive Multi-Error Correction for 3D Memories. In 2017 IEEE International Conference on Computer Design (ICCD), 265-268, IEEE.


Mihai Lefter, George Voicu, Sorin Cotofana (2015). A shared polyhedral cache for 3D wide-I/O multi-core computing platforms. In M de Medeiras Silva (Eds.) Proceedings - 2015 IEEE International Symposium on Circuits and Systems, 425-428, IEEE Society.


Mihai Lefter, Marius Enachescu, George Voicu, Sorin Cotofana (2014). Energy effective 3D stacked hybrid NEMFET-CMOS caches. In JO Klein and CA Moritz (Eds.) Proceedings of the 2014 IEEE/ACM International Symposium on Nanoscale Architectures, 151-156, IEEE Society.


Mihai Lefter, George Voicu, Mottaqiallah Taouil, Marius Enachescu, Said Hamdioui, Sorin Cotofana (2013). Is TSV-based 3D integration suitable for inter-die memory repair?. In s.n. (Eds.) Design, automation & test in Europe conference & exhibition, 1-4, IEEE Society.

Marius Enachescu, Mihai Lefter, A Bazigos, A Ionescu, Sorin Cotofana (2013). Ultra low power NEMFET based logic. In IEEE International symposium on circuits and systems, 566-569, IEEE Society.

George Voicu, Mihai Lefter, Marius Enachescu, Sorin Cotofana (2013). 3D stacked wide-operand adders: A case study. In T El-Ghawazi and M Smith et al (Eds.) Proceedings 2013 IEEE 24th International Conference on Application-specific Systems, Architectures and Processors, 133-141, IEEE Computer Society.


Mottaqiallah Taouil, Mihai Lefter, Said Hamdioui (2012). Exploring test opportunities for memory and interconnects in 3D ICs. In s.n. (Eds.) International design & test symposium, 1-6, s.n..