Marius Enachescu, Mihai Lefter, George Voicu, Sorin Cotofana (2018). Low-Leakage 3D Stacked Hybrid NEMFET-CMOS Dual Port Memory. IEEE Transactions on Emerging Topics in Computing 6 184-199.


Mihai Lefter, Thomas Marconi, George Voicu, Sorin Cotofana (2017). Low cost multi-error correction for 3D polyhedral memories. In 2017 IEEE/ACM International Symposium on Nanoscale Architectures, 13-18, IEEE.

Mihai Lefter, George Voicu, Thomas Marconi, Valentin Savin, Sorin Cotofana (2017). LDPC-Based Adaptive Multi-Error Correction for 3D Memories. In 2017 IEEE International Conference on Computer Design (ICCD), 265-268, IEEE.


George Voicu, Sorin Cotofana (2016). High-performance, Cost-effective 3D Stacked Wide-Operand Adders. IEEE Transactions on Emerging Topics in Computing 5 179-192.


Mihai Lefter, George Voicu, Sorin Cotofana (2015). A shared polyhedral cache for 3D wide-I/O multi-core computing platforms. In M de Medeiras Silva (Eds.) Proceedings - 2015 IEEE International Symposium on Circuits and Systems, 425-428, IEEE Society.


Mihai Lefter, Marius Enachescu, George Voicu, Sorin Cotofana (2014). Energy effective 3D stacked hybrid NEMFET-CMOS caches. In JO Klein and CA Moritz (Eds.) Proceedings of the 2014 IEEE/ACM International Symposium on Nanoscale Architectures, 151-156, IEEE Society.


George Voicu, Sorin Cotofana (2013). Towards heterogenous 3D-stacked reliable computing with von Neumann multiplexing. In s.n. (Eds.) 9th ACM/IEEE International Symposium on Nanoscale Architectures), 1-6, IEEE Society.

Morteza Alavi, George Voicu, Bogdan Staszewski, Leonardus de Vreede, John Long (2013). A 2×13-bit all-digital I/Q RF-DAC in 65-nm CMOS. In TM Hancock (Eds.) Digest of Papers - 2013 IEEE Radio Frequency Integrated Circuits Symposium, 167-170, IEEE Society.

George Voicu, Mihai Lefter, Marius Enachescu, Sorin Cotofana (2013). 3D stacked wide-operand adders: A case study. In T El-Ghawazi and M Smith et al (Eds.) Proceedings 2013 IEEE 24th International Conference on Application-specific Systems, Architectures and Processors, 133-141, IEEE Computer Society.

Mihai Lefter, George Voicu, Mottaqiallah Taouil, Marius Enachescu, Said Hamdioui, Sorin Cotofana (2013). Is TSV-based 3D integration suitable for inter-die memory repair?. In s.n. (Eds.) Design, automation & test in Europe conference & exhibition, 1-4, IEEE Society.