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Zhong Tang, Sining Pan, Miloš Grubor, Kofi A.A. Makinwa (2023), A Sub-1 V Capacitively Biased BJT-Based Temperature Sensor With an Inaccuracy of ± 0.15 ∘ C (3 σ ) From − 55 ∘ C to 125 ∘ C, In IEEE Journal of Solid-State Circuits Volume 58 p.3433-3441.

Sulayman Joof, Semih Doğu, Feza Turgay Çelik, Kamil Karaçuha (2023), A Wideband Dipole Antenna Design for Through-the-Wall Imaging on Security Applications, In Proceedings of the 2023 17th European Conference on Antennas and Propagation (EuCAP) p.1-5, IEEE.

José M. Rivera-Arbeláez, Danjel Keekstra, Carla Cofiño-Fabres, Tom Boonen, Milica Dostanic, Simone A. ten Den, Kim Vermeul, Massimo Mastrangeli, Albert van den Berg, More Authors (2023), Automated assessment of human engineered heart tissues using deep learning and template matching for segmentation and tracking, In Bioengineering and Translational Medicine Volume 8.

Pieter Harpe, Andrea Baschirotto, Kofi A.A. Makinwa (Eds.) (2023), Biomedical Electronics, Noise Shaping ADCs, and Frequency References: Advances in Analog Circuit Design 2022, Springer.

K.A.A. Makinwa, Zhong Tang (2023), Delta-Sigma Modulation Type A/D Converter.

Yunfan Niu, Jiarui Mo, Alexander May, Mathias Rommel, Chiara Rossi, Joost Romijn, Guoqi Zhang, Sten Vollebregt (2023), Design and Characterization of a Data Converter in a SiC CMOS Technology for Harsh Environment Sensing Applications, In Proceedings of the 2023 IEEE SENSORS, IEEE.

Feza Turgay Celik, Alexander Yarovoy, Yanki Aslan (2023), From Cooling to Coupling and Back: A Novel Beam Switching Heatsink Antenna Array With CSRR Embedded Isolation Wall, In IEEE Antennas and Wireless Propagation Letters Volume 22 p.2690 - 2694.

Milica Dostanic, Laura Windt, Maury Wiendels, Berend J. van Meer, Christine L. Mummery, Pasqualina M. Sarro, Massimo Mastrangeli (2023), Highly reproducible tissue positioning with tapered pillar design in engineered heart tissue platforms, In Proceedings of the 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS) p.374-377, IEEE.

Xinrui Ji, Henk Van Zeijl, Weiping Jiao, Shan He, Leiming Du, Guoqi Zhang (2023), Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films, In Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023 p.1237-1243, IEEE.