2018

J.A. Alfaro, Paolo Sberna, Cinzia Silvestri, Max Mastrangeli, Ryoichi Ishihara, Lina Sarro (2018). Vacuum assisted liquified metal (VALM) TSV filling method with superconductive material. In 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018, 547-550, IEEE.

2017

Miki Trifunovic, Paolo Sberna, T Shimoda, Ryoichi Ishihara (2017). Analysis of polydihydrosilane crystallization by excimer laser annealing. Thin Solid Films 638 73-80.

Lieven Vandersypen, H Bluhm, J. S. Clarke, A. S. Dzurak, Ryoichi Ishihara, A. Morello, D. J. Reilly, L. R. Schreiber, Menno Veldhorst (2017). Interfacing spin qubits in quantum dots and donors—hot, dense, and coherent. NPJ Quantum Information 3 34.

Paolo Sberna, Miki Trifunovic, Ryoichi Ishihara (2017). Solution-Based Fabrication of Polycrystalline Si Thin-Film Transistors from Recycled Polysilanes. ACS Sustainable Chemistry and Engineering 5 5642-5645.

Michiel van der Zwan, Ryoichi Ishihara, Miki Trifunovic (2017). Method of forming silicon on a substrate.

Miki Trifunovic, T Shimoda, Ryoichi Ishihara, Paolo Sberna (2017). Solution-based polycrystalline silicon transistors produced on a paper substrate. npj Flexible Electronics 1.

Miki Trifunovic, Paolo Sberna, T. Shimoda, Ryoichi Ishihara (2017). Polycrystalline Silicon TFTs on a Paper Substrate Using Solution-Processed Silicon. In Patrick Fay (Eds.) 2016 IEEE International Electron Devices Meeting, IEDM 2016, 1-4, IEEE.

Gennaro Gentile, Ryoichi Ishihara (2017). A 2.4 GHz to 27 MHz non-linear RFID topology in flexible electronics. In IET Conference Publications, 1-5, Institution of Engineering and Technology.

2016

Rene Poelma, Ryoichi Ishihara, Guo Qi Zhang (2016). Characterization and multi-scale modelling of nanofoam materials for qubit integration at cryogenic temperatures. In 2nd 4TU.HTM Symposium Dutch Materials 2016.

Sten Vollebregt, Ryoichi Ishihara (2016). Carbon nanotubes as vertical interconnects for 3D integrated circuits. In A. Todri-Sanial and J. Dijon and A. Maffucci (Eds.) Carbon Nanotubes for Interconnects, 195-213, Springer.